Altera’s next-generation product families will introduce advanced 3D die-stacking technology to enable new classes of applications and new levels of systems integration. This technology will feature a highly customer-accessible mixed-system digital interface standard enabling low latency and low power-enabling FPGA integration with memory extensions (SRAM, DRAM), optical transceiver modules, and user-optimized HardCopy® ASICs. The applications of this 3D integration technology will be fueled by the innovations and creativity of the worldwide Altera user community.
Altera Europe LTD will be exhibiting at the upcoming IBC2013, September 12 – 17, RAI Amsterdam. Drop by the Altera Europe LTD stand # 10.A10.
